PTC silicon die precision thermistors are used in wire-bonding and specialized reflow-soldering applications.  Board attachment by either wire bonding, conductive epoxy, or a combination of both may be used. Solder attachment may be performed using different solder configurations, however it is not recommended.

Engineering Information
•   Part size: 0.032” by 0.032” square
•   Part thickness: 0.028”, 0.050” or 0.072”
•   Positive temperature coefficient: 0.7%/˚C
•   Operating temperature range: -55˚C to 125˚C
•   Typical Dissipation Constant: 2mW/˚C min. in still air
•   Typical Time Constant: 8 seconds max in still air
•   Tolerances: 1%, 2%, 5%, 10%
•   Power rating: 0.0625 W at 25˚C, derate to 0 W at 125˚C (Table 2)
•   Resistance values from 10 ohms to 10k ohms
•   Available with gold terminations
•   Board attachment by either wire bonding or conductive epoxy
•   RoHS compliant
•   Available waffle packed or tape and reel